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CM1441 4-Channel EMI Filter Array w/ ESD + 4-channel ESD Array
Features
* * * * * * * * Four channels of EMI filtering with integrated ESD protection Four channels of ESD-only protection 0.4mm pitch, 15-bump, 2.360mm X 1.053mm footprint Chip Scale Package (CSP) Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network 30kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) 30kV ESD protection on each channel (HBM) Greater than 35dB attenuation (typical) at 1 GHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance OptiGuardTM coated for improved reliability at assembly Lead-free version available
Product Description
The CM1441 is a multichannel EMI/ESD array consisting of four low-pass filter + ESD channels to reduce EMI emissions on data ports and lines and four dedicated ESD-only channels. Each EMI filter channel integrates a high quality pi-style filter (30pF-100-30pF) which provides greater than 30dB of attenuation in the 800MHz to 2.7GHz frequency range. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). All ESD protection diodes safely dissipate ESD strikes of 30kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than 30kV. This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. In particular, the CM1441 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1441 incorporates OptiGuardTM which results in improved reliability at assembly. The CM1441 is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space saving vs. competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball.
* *
Applications
* * * * * * LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules
Electrical Schematic
100 FILTER+ESDn* (Pins A2-A5) FILTER+ESDn* (Pins C2-C5) ESDn* (Pins A1, A6, C1, C6)
30pF
30pF
30pF
GND (Pins B1-B3)
1 of 4 EMI/RFI + ESD Channels.
* See Package/Pinout Diagram for expanded pin information.
(c) 2005 California Micro Devices Corp. All rights reserved. 11/08/05
1 of 4 ESD-only Channels
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
1
CM1441
PACKAGE / PINOUT DIAGRAMS (Bumps Down View)
Orientation Marking (see note 2)
TOP VIEW
BOTTOM VIEW
(Bumps Up View)
FILTER2 FILTER3
1 A B C
2
3
4
5
6
ESD3 FILTER1 FILTER4 ESD4
C1
C2
GND
C3
GND
C4 B2
C5
GND
C6 B3
N417
B1 Orientation Marking
A1
ESD1 FILTER1
FILTER2
FILTER3
FILTER4
ESD2
A1
A2
A3
A4
A5
A6
Notes: 15 Bump CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CM1441-07CS/CP
PIN DESCRIPTIONS
PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 C1 C2 C3 C4 C5 C6 NAME ESD1 FILTER1 FILTER2 FILTER3 FILTER4 ESD2 GND ESD3 FILTER1 FILTER2 FILTER3 FILTER4 ESD4 DESCRIPTION ESD Channel 1 Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 ESD Channel 2 Device Ground ESD Channel 3 Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 ESD Channel 4
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Bumps 15 Package CSP Ordering Part Number1 CM1441-07CS Part Marking N417 Lead-free Finish2 Ordering Part Number1 CM1441-07CP Part Marking N417
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/08/05
CM1441
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL R CTOTAL C VDIODE ILEAK VSIG PARAMETER Resistance Total Channel Capacitance Capacitance C1 Standoff Voltage Diode Leakage Current (reverse bias) Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50, ZLOAD=50
Note 1: Note 2: Note 3: Note 4:
CONDITIONS At 2.5VDC Reverse Bias, 1MHz, 30mVAC At 2.5VDC Reverse Bias, 1MHz, 30mVAC IDIODE=10A VDIODE=+3.3V ILOAD = 10mA ILOAD = -10mA Notes 2, 3 and 4
MIN 80 48 24
TYP 100 60 30 6.0 0.1
MAX 120 72 36
UNITS pF pF V
1 9.0 -0.4
A V V kV kV
5.6 -1.5 30 30
6.8 -0.8
VESD
RDYN
2.3 0.9 R=100, C=30pF 60
MHz
fC
TA=25C unless otherwise specified. ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open These parameters are guaranteed by design and characterization.
(c) 2005 California Micro Devices Corp. All rights reserved. 11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
3
CM1441
Performance Information
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A2-C2 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A3-C3 to GND B2)
(c) 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/08/05
CM1441
Performance Information (cont'd)
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A4-C4 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A5-C5 to GND B3)
(c) 2005 California Micro Devices Corp. All rights reserved. 11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
5
CM1441
Performance Information (cont'd)
Typical Diode Capacitance vs. Input Voltage
Capacitance (Normalized)
DC Voltage
Figure 5. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5VDC and 25C)
(c) 2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/08/05
CM1441
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 240C 260C
Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA.
Figure 6. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 7. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2005 California Micro Devices Corp. All rights reserved. 11/08/05
Figure 8. Lead-free (SnAgCu) Solder Ball Reflow Profile
Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
7
CM1441
Mechanical Details
CSP Mechanical Specifications CM1441 devices are supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document.
C1
Mechanical Package Diagrams
BOTTOM VIEW
A1 B1 C B A B2 B4 B3
OptiGuardTM Coating
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 2.315 1.008 0.395 0.195 Nom 2.360 1.053 0.4000 0.2000 Max 2.405 1.098 0.405 0.205 Min 0.911 Custom CSP 15 Inches Nom Max 0.0929 0.0947
A2
C2
1
2
3
4
5
6 D1 D2
0.0397 0.0415 0.0432 0.0156 0.0157 0.0159 0.0076 0.0078 0.0080
0.25 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
SIDE VIEW
DIMENSIONS IN MILLIMETERS
0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 0.130 0.130 0.575 0.368 0.1800 0.1800 0.644 0.419 0.230 0.230 0.714 0.470 0.0051 0.0071 0.0091 0.0051 0.0071 0.0091 0.0226 0.0254 0.0281 0.0145 0.0165 0.0185
Package Dimensions for CM1441 Chip Scale Package
# per tape and reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER CM1441 CHIP SIZE (mm) 2.36 x 1.053 x 0.644 POCKET SIZE (mm) B0 X A0 X K0 2.62 x 1.12 x 0.76
Po Top Cover Tape
TAPE WIDTH W 8mm
REEL DIAMETER 178mm (7")
QTY PER REEL 3500
P0 4mm
P1 4mm
10 Pitches Cumulative Tolerance On Tape 0.2 mm
Ao W Bo
Ko
For Tape Feeder Reference Only including Draft. Concentric Around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 9. Tape and Reel Mechanical Data
(c) 2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
11/08/05

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